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TDK-Lambda mentors students in STEM competition, and they win
Engineers from TDK-Lambda UK supported a team of students from The Ilfracombe Academy in the international STEM competition, F1 in Schools. "TDK-Lambd...
NXP to sample Layerscape in April for multi-access technologies
In April, NXP intends to sample a family of programmable, multi-standard SoCs for multi-access technologies including 5G. The Layerscape Access family...
Cloud spending to top $122bn in 2017
Worldwide spending on cloud services and infrastructure will reach $122.5 billion in 2017, an increase of 24.4% over 2016, says IDC. Over the 2015-202...
BeagleBone Black gets wireless and display for industrial users
Farnell is aiming at industrial users with two ‘cape’ add-on boards for BeagleBone Black: one for wireless comms and another that adds a display. On...
Taiwan leads in fab capacity
Taiwan led all regions in wafer capacity with 21.3% share, a slight decrease from 21.7% in 2015 when the country first became the global wafer capacit...
Intel, UC Berkeley, Honeywell, GE, Ericsson form 5G innovators group
Ericsson, Honeywell, GE, UC Berkeley and Intel are launching the 5G Innovators Initiative (5GI2), an open industry initiative designed to join major e...
CEVA DSP for multi-gig modems
CEVA has introduced a communication DSP to meet the performance requirements of multi-gigabit class modems. The CEVA-XC12 aims to efficiently implemen...
Graphcore visualises artificial intelligence in action
This is what a machine learning algorithm looks like, according to Nigel Toon, CEO of Bristol start-up Graphcore. The false colour image has been crea...
Hydronium-ion battery mooted for grid storage
Hydronium-ion batteries show promise for sustainable high-power energy storage, according to scientists at Oregon State University, which claims to ha...
MWC: Modular 5G antenna stacks for high data rate
Taoglas has unveiled its series of modular 5G massive MIMO antenna arrays. The new antennas – including the 5-6GHz Adaptrix CMM200.A (pictured) – fe...
Toshiba sampling 64-layer 512Gbit 3D NAND
Toshiba is sampling 64-layer 3-bit-per cell 512Gbit 3D NAND. Mass production is scheduled for H2. In April Toshiba plans to sample a 1Tbyte product w...
Intel reveals Atom processors with up to 16 cores
Intel has release some details of its forthcoming C3000 Atom processors. Designed for network and storage products, the family provides up to 16 compu...
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